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High-Speed Routing Components for Next-Gen Optical Communication Networks
2025-07-28 High-Speed Routing Components for Next-Gen Optical Communication Networks

Core Technical AdvantagesMicro-optical switches—miniaturized devices that control the path of optical signals (e.g., redirect, split, or block light) via micro-electro-mechanical systems (MEMS), liquid crystals (LC), or photonic integrated circuits (…

Critical Heat Dissipation Solutions for High-Power Electronics
2025-07-28 Critical Heat Dissipation Solutions for High-Power Electronics

Core Technical AdvantagesThermal Interface Materials (TIMs)—materials designed to fill air gaps between heat-generating components (e.g., CPUs, IGBTs, LEDs) and heat sinks/coolers—are indispensable for managing heat in high-power electronics. Unlike…

Enabling the Future of Display and Flexible Electronics
2025-07-28 Enabling the Future of Display and Flexible Electronics

Core Technical AdvantagesPhotonic Integrated Circuits (PICs)—microchips that integrate multiple photonic components (lasers, modulators, detectors, waveguides, and switches) on a single substrate—revolutionize light-based technologies by overcoming …