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Core Technical AdvantagesMicro-optical switches—miniaturized devices that control the path of optical signals (e.g., redirect, split, or block light) via micro-electro-mechanical systems (MEMS), liquid crystals (LC), or photonic integrated circuits (…

Core Technical AdvantagesThermal Interface Materials (TIMs)—materials designed to fill air gaps between heat-generating components (e.g., CPUs, IGBTs, LEDs) and heat sinks/coolers—are indispensable for managing heat in high-power electronics. Unlike…

Core Technical AdvantagesPhotonic Integrated Circuits (PICs)—microchips that integrate multiple photonic components (lasers, modulators, detectors, waveguides, and switches) on a single substrate—revolutionize light-based technologies by overcoming …

Core Technical CharacteristicsOrganic Light-Emitting Diodes (OLEDs) represent a revolutionary display technology that generates light directly from organic semiconductor materials, eliminating the need for backlighting used in traditional LCDs. Their …

Core Technical AdvantagesGallium Oxide (Ga₂O₃) power devices—semiconductor components based on the ultra-wide-bandgap (UWBG) material gallium oxide—redefine high-voltage energy conversion by outperforming traditional power semiconductors (silicon,…

Core Technical AdvantagesIndium Gallium Zinc Oxide (IGZO) thin-film transistors (TFTs)—semiconductor devices fabricated as thin films (10-50 nm thick) on rigid or flexible substrates (glass, plastic, metal foil)—redefine the performance of display d…